Articles from Lorentz Solution, Inc.

Lorentz Solution, Inc., the world's leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held on Sept 23, 2026 in Santa Clara, CA. Their paper, "Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom Silicon IC/3DIC Designs with PeakView®," marks the third consecutive year that Lorentz™ and NVIDIA will present cutting-edge EM technologies for real silicon designs at TSMC OIP.

Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the TSMC 2025 Open Innovation Platform. Their paper, “Large-Scale 3D Terahertz EM Design and Signoff for 3DIC-Based Silicon Photonics with Silicon Case Studies”, marks their second year jointly presenting cutting-edge photonic designs powered by PeakView®’s TeraHz 3D EM technology at TSMC OIP.

Lorentz Solution, Inc., the world’s leading provider on electromagnetic (EM) design and simulation, today announced that it is jointly presenting a paper with Nvidia at the TSMC 2024 Open Innovation Platform Ecosystem Forums around the world. TSMC OIP brings together the semiconductor design community for the exhibition of the latest technologies and design solutions. The paper is titled, “Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Photonics Applications with PeakView®.”

Lorentz Solution, renowned for its PeakView electromagnetic (EM) design platform with unmatched 3D fullwave accuracy, has achieved certification on Intel 18A process technology using Intel standard golden reference data. This collaborative milestone represents a significant leap, firmly establishing PeakView as the standard tool for 3D EM design for Intel 18A process technology. The success story behind PeakView owes much to its cutting-edge features, including brute-force 3D simulation on metal fill and efficient volume meshing. These capabilities empower designers with unparalleled accuracy and efficiency in capturing the critical 3D current and charge distribution and EM effects.